LE-600 is a two-component liquid white photosensitive solder mask ,which mainly made of the resin, photosensitive materials, fillers, pigments, solvents and other components .It's a excellent white solder mask for the specifically LED PCB, which have excellent resistance to high temperature deformation yellow, highly reflective, anti-chemical corrosion, solder graphic precision, good adhesion for the circuit board of sprayed tin and plated gold.
Sheet adhesive in the Pyralux product line is a proprietary B-staged modified acrylic adhesive coated on release paper. Sheet adhesive is used primarily to bond flexible innerlayers or rigid cap layers in multilayer lamination.
Megtron 6 is a new generation, advanced material designed for high frequency (Low Dk, low Df) circuit board applications. Megtron 6’s electrical properties are competitive with PTFE–based materials, but with improved processability.
Nelco N4000-13 EP is an enhanced epoxy resin system engineered for today’s lead-
free requirements where multiple solder reflow at temperatures approaching 260oC are required.
The Nelco N4000-13 series is an enhanced epoxy resin system engineered to provide both outstanding thermal and high signal speed / low signal loss properties. N4000-13 SIis excellent for applications that require optimum signal integrity and precise impedance control, while maintaining high reliability through CAF2 and thermal resistance.