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Posted on 27/03/2024

Organic Materials

Exploring Organic Substrate Materials for Lightweight and Flexible PCBs

As the demand for lighter, thinner, and more flexible electronic devices increases, the choice of substrate material becomes crucial. Organic substrate materials have emerged as a game-changer in PCB design, offering lightweight and flexible solutions.

Understanding Organic Substrate Materials: Organic substrate materials are composed of various organic compounds, including polymers, resins, and additives. These materials provide the structural support for the components and interconnections on a PCB. In contrast to traditional rigid substrates like fiberglass-reinforced epoxy, organic substrates offer greater flexibility and lower weight, making them ideal for applications that require lightweight and flexible electronics.

Advantages of Organic Substrate Materials for Lightweight and Flexible PCBs:

  1. Weight Reduction: Organic substrate materials excel in reducing the weight of PCBs. Unlike rigid substrates, which often contribute significantly to the overall weight of an electronic device, organic materials are lightweight and have a high strength-to-weight ratio. This advantage is particularly important in portable devices, aerospace applications, and wearable technology, where weight reduction is critical for improved comfort and mobility.

  2. Flexibility and Bendability: The inherent flexibility of organic substrate materials enables the creation of flexible PCBs, also known as Flex PCBs. These substrates can be bent, folded, and twisted, allowing for unique form factors and conformal designs. Flex PCBs are well-suited for applications where space is limited or where the PCB needs to conform to irregular shapes or contours, such as curved displays, medical devices, and automotive interiors.

  3. High-Density Interconnects: Organic substrate materials offer excellent dielectric properties, allowing for higher density interconnects. The thin and flexible nature of these substrates enables the placement of components in close proximity, reducing signal propagation delays and improving overall performance. With the ability to accommodate fine-pitch components and intricate circuitry, organic substrates enable miniaturization and high-density integration, crucial for modern electronics.

  4. Improved Signal Integrity: Organic substrates provide better signal integrity compared to traditional rigid substrates. Their low dielectric constant and loss tangent contribute to reduced signal reflections, crosstalk, and electromagnetic interference (EMI). This advantage is particularly relevant for high-frequency applications, such as wireless communication systems and RF devices, where signal quality and integrity are paramount.

  5. Enhanced Reliability: Organic substrate materials offer good thermal stability and mechanical resilience, contributing to enhanced reliability. They can withstand temperature variations, thermal cycling, and mechanical stress without compromising the structural integrity or electrical performance of the PCB. This reliability is vital in applications where the PCB is subjected to demanding operating conditions, such as automotive, aerospace, and industrial environments.

  6. Cost Efficiency: Organic substrate materials often provide cost advantages over traditional rigid substrates. The manufacturing processes for organic substrates are generally more efficient and cost-effective, leading to reduced production costs. Additionally, the lightweight nature of these substrates can result in lower shipping and handling costs, making them an attractive option for cost-conscious manufacturers.

Conclusion: Organic substrate materials have revolutionized PCB design by enabling lightweight and flexible solutions. With their weight reduction capabilities, flexibility, high-density interconnects, improved signal integrity, enhanced reliability, and cost efficiency, these materials have opened up new possibilities in electronics manufacturing. As the demand for lightweight and flexible devices continues to grow, organic substrates will play a pivotal role in shaping the future of PCB technology, enabling the development of innovative and versatile.

For further information on PCB Organic Materials for your next PCB design project please don’t hesitate to contact the team at sales@pcbglobal.com

Posted on 27/02/2024

Printed circuit boards (PCBs) are an essential component of almost all electronic devices. The PCB surface finish plays a vital role in determining the overall functionality and reliability of the device. Immersion silver surface finish has become increasingly popular in recent years due to its many advantages over other finishes. In this blog, we will discuss the benefits of immersion silver surface finish on PCBs.

  1. High Conductivity: Immersion silver surface finish provides excellent conductivity, making it ideal for high-frequency applications. Silver is the best conductor among all metals, and the immersion process ensures that the silver layer is uniform and has good adhesion to the copper layer. This results in low contact resistance, which is crucial for the performance of high-frequency circuits.

  2. Corrosion Resistance: Silver is known for its excellent corrosion resistance properties, and immersion silver surface finish is no exception. The immersion process forms a protective layer on the copper layer, preventing it from oxidizing and corroding. This ensures that the PCB remains functional and reliable for a longer period.

  3. Solderability: The surface finish on a PCB must be solderable for efficient and reliable assembly. Immersion silver surface finish provides excellent solderability due to the formation of a thin layer of silver oxide. This layer improves the wetting and spreading of the solder, ensuring a reliable joint. The solderability of immersion silver is comparable to that of other surface finishes such as HASL (hot air solder leveling) and ENIG (electroless nickel immersion gold).

  4. Flatness: Immersion silver surface finish provides a flat and smooth surface, which is essential for fine-pitch components such as ball grid arrays (BGAs). The immersion process ensures that the silver layer is uniform, providing a flat and level surface for component attachment. This improves the reliability of the PCB as it minimizes the risk of solder bridging and opens.

  5. Cost-Effective: Immersion silver surface finish is a cost-effective solution compared to other surface finishes such as ENIG. ENIG involves multiple processing steps, including nickel deposition, gold deposition, and immersion gold, making it more expensive than immersion silver. Immersion silver surface finish provides similar properties to ENIG, such as solderability and corrosion resistance, making it an ideal choice for cost-sensitive applications.

  6. Environmental Compatibility: Immersion silver surface finish is an environmentally friendly option compared to other surface finishes such as HASL, which involves the use of lead. The immersion silver process does not use lead or any other hazardous materials, making it a safe and sustainable option.

  7. Surface Planarity: The immersion silver process provides a uniform layer that results in a flat surface. This uniformity is essential for surface-mounted device (SMD) soldering, especially for ball-grid arrays (BGAs). The flatness of the immersion silver surface ensures that there is no solder bridging or opens during the soldering process.

  1. Repeatability: The immersion silver process is a repeatable process, providing consistency in surface finish quality. The uniformity of the silver layer ensures that there is no variation in surface finish from board to board.

  2. Shelf Life: Immersion silver surface finish needs to be stored and handled carefully, PCB’s must remain in the sealed packaging until ready for SMT assembly, Immersion Silver is anhydrous which will absorb moisture from the atmosphere and easily tarnish.

In conclusion, immersion silver surface finish offers several advantages over other surface finishes for PCBs. These advantages include high conductivity, corrosion resistance, excellent solderability, flatness, cost-effectiveness, environmental compatibility, surface planarity, repeatability, and long shelf life. Immersion silver surface finish is an ideal choice for high-frequency applications, fine-pitch components, and cost-sensitive applications. With its excellent performance and sustainability

For further information on Immersion Silver surface finish for your next leading edge PCB project please do not hesitate to contact the team at sales@pcbglobal.com

Posted on 26/01/2024

Organic Solderability Preservatives (OSPs) is a surface finish that is becoming increasingly popular in the PCB industry. OSP surface finish is a thin layer of organic material that is applied to the surface of a bare PCB to protect it from oxidation, corrosion, and other forms of degradation. In this blog, we will discuss the benefits of OSP surface finish on PCBs.

  1. Cost-Effective: OSP surface finish is a cost-effective solution compared to other surface finishes such as electroless nickel immersion gold (ENIG) and immersion silver. OSP is a simpler process that requires fewer steps, making it less expensive. This makes OSP surface finish an ideal choice for cost-sensitive applications.

  2. Solderability: The primary function of any surface finish is to ensure that the PCB is solderable. OSP surface finish provides excellent solderability due to its thin, uniform layer. The OSP layer protects the copper layer from oxidation, ensuring a reliable solder joint. The solderability of OSP is comparable to other surface finishes such as ENIG and immersion silver.

  3. Flatness: OSP surface finish provides a flat and smooth surface, which is essential for fine- pitch components such as ball grid arrays (BGAs). The OSP layer is very thin and does not significantly affect the flatness of the copper layer. This results in a flat and level surface for component attachment, improving the reliability of the PCB.

  4. Environmental Compatibility: OSP surface finish is an environmentally friendly option compared to other surface finishes such as hot air solder leveling (HASL) which involves the use of lead. The OSP process does not use any hazardous materials, making it a safe and sustainable option.

  5. High Temperature Capability: OSP surface finish can withstand high temperatures, making it ideal for applications that require high-temperature processing, such as surface-mount technology (SMT). The OSP layer does not decompose at high temperatures, ensuring that the PCB remains functional and reliable.

  6. No Nickel Contamination: ENIG surface finish involves the use of nickel, which can cause contamination in certain applications. OSP surface finish does not involve the use of nickel, making it an ideal choice for applications that require nickel-free PCBs.

  7. Long Shelf Life: OSP surface finish has a long shelf life compared to other surface finishes such as HASL. The organic layer formed on the copper layer during the OSP process prevents oxidation and corrosion, ensuring that the PCB remains functional even after extended periods of storage.

  8. Good for Fine-Pitch Components: OSP surface finish provides excellent planarity, which is essential for fine-pitch components such as BGAs. The thin, uniform layer of OSP ensures that there is no variation in surface finish from board to board, improving the reliability of the PCB.

  9. Lead-Free: OSP surface finish is a lead-free option, making it compliant with environmental regulations such as the Restriction of Hazardous Substances (RoHS) directive. This ensures that the PCB is safe for use in various applications.

In conclusion, OSP surface finish offers several advantages over other surface finishes for PCBs. These advantages include cost-effectiveness, excellent solderability, flatness, environmental compatibility, high-temperature capability, no nickel contamination, long shelf life, good for fine-pitch components, and lead-free. OSP surface finish is an ideal choice for cost-sensitive applications, high-temperature applications, nickel-free applications, and lead-free applications. With its excellent performance and sustainability, OSP surface finish is a preferred option for many PCB manufacturers.

For further information on OSP surface finish for your next PCB project please don’t hesitate to contact the team at sales@pcbglobal.com

Posted on 30/12/2023

Printed Circuit Boards (PCBs) are the backbone of modern electronic devices, providing the necessary platform for components and circuitry. PCB surface finish plays a crucial role in ensuring the reliability and performance of electronic assemblies. One commonly used surface finish that complies with RoHS regulations is Hot Air Leveling (HAL). In this blog post, we will delve into the details of ROHS HAL as a surface finish, its advantages, and its application in the electronics industry.

What is ROHS HAL? RoHS (Restriction of Hazardous Substances) is a directive that restricts the use of certain hazardous substances in electrical and electronic equipment. HAL, short for Hot Air Leveling, is a PCB surface finish that complies with RoHS regulations. It involves immersing the PCB in a bath of molten tin which is 99.99% pure tin and 0.01% copper and then passing it through a hot air knife to remove the excess tin, leaving a flat and even surface.

Advantages of ROHS HAL:

  1. RoHS Compliance: One of the primary advantages of ROHS HAL is its compliance with RoHS regulations. It eliminates the use of hazardous substances such as lead, cadmium, and mercury, making it environmentally friendly and safe for both users and the environment.

  2. Cost-Effective: HAL is a cost-effective surface finish option compared to other alternatives like electroless nickel immersion gold (ENIG) or immersion tin. HAL offers good solderability and ensures a consistent surface finish, making it suitable for a wide range of applications while keeping the overall production costs lower.

  3. Good Solderability: HAL provides excellent solderability, which is critical for the reliability of electronic assemblies. The flat surface and thin layer of solder promote proper wetting and bonding between the component leads and the PCB, resulting in reliable solder joints.

  4. Excellent Shelf Life: ROHS HAL offers an extended shelf life compared to some other surface finishes. The flat and even surface reduces the risk of oxidation and corrosion, ensuring that the PCBs remain in optimal condition during storage and transportation.

  5. Easy Rework and Repair: Another advantage of HAL is its ease of rework and repair. If a component needs to be replaced or repaired, the excess solder can be easily removed, and a new component can be soldered in its place without significant difficulties. This makes HAL a suitable choice for prototypes and low-volume production runs.

  6. Relatively flat compared to the Leaded HASL surface finish, will never be as flat as any of the Immersion finishes – Gold, Silver Tin, EPIG, ENIG, ENEPIG, ISIG or OSP, but very reliable for medium to high technology SMD component assemblies.

Applications of ROHS HAL: ROHS HAL surface finish finds its application in various industries, including:

  1. Consumer Electronics: HAL is widely used in consumer electronic devices like smartphones, tablets, laptops, and gaming consoles. Its cost-effectiveness and excellent solderability make it an ideal choice for high-volume production.

  2. Industrial Equipment: Many industrial equipment, such as control panels, power supplies, and automation systems, use HAL as a surface finish. The ability to handle high-temperature environments and its rework ability make it suitable for industrial applications.

3. Automotive Electronics: Automotive electronics demand robust and reliable PCB surface finishes. HAL meets these requirements and is commonly used in automotive electronic control units (ECUs), dashboard electronics, and other critical automotive applications.

Conclusion: ROHS HAL is a popular surface finish for PCBs due to its compliance with RoHS regulations, cost-effectiveness, good solderability, extended shelf life, and ease of rework and repair. It finds widespread application in consumer electronics, industrial equipment, and automotive electronics. By understanding the advantages and applications of ROHS HAL, electronics manufacturers can make informed decisions about choosing the right surface finish for their PCBs, ensuring high-quality and reliable electronic assemblies.

For further information on ROHS HAL surface finish for your next PCB project please don’t hesitate to contact the team at sales@pcbglobal.com

The Advantages of ISIG PCB Surface Finish: Enhancing Performance and Reliability

In the realm of printed circuit boards (PCBs), selecting the right surface finish is crucial for ensuring optimal performance and reliability. One such surface finish that has gained significant popularity is Immersion Silver (ISIG). In this blog post, we will delve into the advantages of ISIG PCB surface finish and explore how it can enhance the functionality and longevity of electronic devices.

  1. Excellent Solderability - One of the primary advantages of ISIG PCB surface finish is its excellent solderability. The thin layer of silver coating enables a high level of compatibility with various solder alloys, making it ideal for both lead-based and lead-free soldering processes. ISIG surface finish offers a flat and even surface, ensuring proper wetting and strong solder joints. This feature is particularly beneficial for small components with tight pitch requirements, such as surface mount devices (SMDs), where reliable solder connections are crucial for overall PCB performance.

  2. Good Electrical Performance - ISIG surface finish also exhibits excellent electrical properties. The thin silver coating offers low contact resistance, ensuring efficient signal transmission across the PCB. This feature is especially advantageous for high-frequency applications where signal integrity is of utmost importance. The smooth surface of ISIG finish minimizes signal losses and impedance variations, allowing for improved electrical performance and reduced signal distortion. Additionally, the low resistivity of silver compared to other surface finishes enhances the conductivity of the PCB, reducing power losses and improving overall energy efficiency.

  3. Anti-Tarnish and Corrosion Resistance - ISIG surface finish provides excellent anti-tarnish and corrosion resistance properties. The immersion silver layer acts as a protective barrier, preventing the underlying copper traces from oxidation and degradation due to exposure to moisture and contaminants. This enhanced resistance to tarnish and corrosion ensures the long-term reliability and durability of the PCB, even in harsh operating conditions. Furthermore, ISIG finish offers better protection against environmental factors compared to other surface finishes, making it an ideal choice for applications subjected to high humidity, temperature variations, and exposure to pollutants.

  4. Compatibility with Multiple Assembly Processes - Another advantage of ISIG PCB surface finish is its compatibility with various assembly processes. Whether it is wave soldering, reflow soldering, or manual soldering, ISIG finish offers reliable solder joint formation and compatibility with different manufacturing techniques. This flexibility makes it a versatile surface finish that can be seamlessly integrated into diverse production processes. Furthermore, ISIG surface finish is easily reworkable, allowing for repairs and modifications when required, without compromising the overall integrity of the PCB.

  5. Similar to EPIG, ISIG is also Ideal for non-magnetic applications such as GPS, and radioactive type applications, contains no Nickel so will not interfere with sensitive magnetic fields.

Conclusion - ISIG PCB surface finish offers a multitude of advantages that contribute to the overall performance and reliability of electronic devices. Its excellent solderability, good electrical performance, anti-tarnish and corrosion resistance, and compatibility with various assembly

processes make it a compelling choice for PCB designers and manufacturers. By utilizing ISIG surface finish, engineers can enhance the functionality and longevity of their electronic products, ensuring superior performance and customer satisfaction.

For further information on ISIG surface finish for your next leading edge PCB project please don’t hesitate to contact the team at sales@pcbglobal.com

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