Layers | 12 Layers |
Material | High TG TU-768 |
Thickness | 1.6 mm Thickness |
Copper Finish | 1/1/1/0.5/0.5/0.5/0.5/0.5/0.5/1/1/1oz Copper |
Surface Finish | Immersion Gold - ENIG |
Technology | Impedance Control |
Layers | 10 Layers |
Material | High TG 180A |
Thickness | 1.6 mm Thickness |
Copper Finish | 1/1/1/1/1/1/1/1/1/1oz Copper |
Surface Finish | Immersion Gold - ENIG |
Technology | Blind Vias |
Layers | 6 Layers |
Material | High TG TU-768 |
Thickness | 2.4mm Thickness |
Copper Finish | 2/2/2/2/2/2oz Copper |
Surface Finish | Immersion Gold - ENIG |
Technology | . |
Layers | 10 Layers |
Material | High TG IT180A + Panasonic Polyimide Flex |
Thickness | 1.6 mm Thickness |
Copper Finish | 1/1/0.5/0.5/0.5/0.5/0.5/0.5/1/1oz Copper |
Surface Finish | Immersion Gold - ENIG |
Technology | 6 layers of Flex PCB |
Layers | 2 Layers |
Material | Arlon 85N |
Thickness | 1.0mm Thickness |
Copper Finish | 1/1oz Copper |
Surface Finish | Immersion Gold - ENIG |
Technology | Edge Plating |