• Lead-free compatible FR-4 laminate
• UV blocking/AOI compatible
• High TG halogen-free product, TG 170°C (DSC)
• Lower Z-axis CTE
• Lower dissipation, DF<0.01

• High bonding strength, good dimensional stability, flammability UL94 V-0
• Excellent soldering reliability, chemical resistance and electrical properties
• Low adhesive flowing, good processability, suitable for both fast and traditional laminate styles
• Compatible with EU RoHS directive, free of Pb, Hg Cd, Cr6+, PBB, PBDE, ect.

• Halogen free, flammability UL94 V-0
• Excellent flexibility, thermal resistance, dimensional and electric properties
• Compatible with EU RoHS directive, free from Pb, Hg, Cd, Cr6+, PBB, PBDE, ect.

• Lead-free compatible FR-4 laminate
• High TG 170 °C (DSC)
• Excellent thermal stability
• Excellent anti-CAF performance
• Low Z-axis CTE
• Low water absorption

ThinFlex A-3005RD is an adhesiveless double-sided (D/S) copper clad laminate, using UBE TPI film and laminated with RA copper foil on both sides. ThinFlex A-3005RD adhesiveless D/S composites are designed for a wide variety of flexible circuit applications which require advanced material performance, temperature resistance, fine pitch, and high reliability.